8/12 inch compatible
Ultra-fast UV picro-second laser. Excellent process results
Automatic adjustment of grooving width
Auto-focus, image memorization and identification, manual/auto mode switching function
Multi-CCD positioning & reinspection function
| Technical specifications | |
| Wafer Size | 8 inch, 12 inch |
| Wafer thickness | 70-700μm |
| Scribe channel width | ≥40μm |
| Grooving width | 30-80μm adjustable |
| Processing speed | 300-1000mm/s |
| Positioning accuracy | ±2μm |
| Grooving depth | 10-20μm |
| Cutting Depth accuracy | ±3μm |
| Grooving accuracy of the whole piece | ±8μm |
